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Electronic Chemicals: Performance Products

KMG Electronic Chemical’s Performance Products Group offers a broad range of products and services required to achieve specific application criteria in semiconductor manufacturing. The increasingly finer line geometries required of semiconductor fabs worldwide make the precision manufacturing and blending of custom performance process chemicals more critical than ever.

In order to meet these critical needs, KMG Electronic Chemicals offers:

  • Temperature-controlled manufacturing, storage, transportation and delivery
  • Premixed products manufactured to exacting specifications
  • Statistical process control of assay

KMG Electronic Chemical ensures the consistency of etchants and mixes through stringent mixing procedures, sampling protocol and control of trace metals.

The Performance Products Group will manufacture to your custom specifications or we can provide our own products recommended for such applications.

What sets KMG’s Performance Products Group apart is quality.  Each product is mixed in a cleanroom environment, filtered and particle counted, and packaged in containers specially designed and manufactured for us to preserve the integrity of the chemicals you purchase.

Expand for Description and Associated Downloads
Acetic Copper Clean

Acetic Copper Clean is a mixed acid etch (MAE) with high acetic acid content and low nitric acid and hydrofluoric acid. It allow for controlled etching in special applications.

Solution Container Type Download Datasheet
Acetic Copper Clean BOTTLE Download

Aluminum Etch

Aluminum Etch allows for the controlled removal of excess aluminum, leaving a well-defined pattern of aluminum wiring.

Solution Container Type Download Datasheet
Aluminum Etch 85:2:13 BOTTLE Download
Aluminum Etch 16:1:1:2 BOTTLE Download
Aluminum Etch 16:1:1:2 DRUM Download
Aluminum Etch 16:13:1:2 BOTTLE Download
Aluminum Etch 16:9:1:2 DRUM Download
Aluminum Etch II w/ Surfactant NP BOTTLE Download
Aluminum Etch II w/ Surfactant NP DRUM Download
Aluminum Etch w/ Surfactant NP 16:1:1:2 BOTTLE Download
Aluminum Etch w/ Surfactant NP 16:1:1:2 DRUM Download

Ammonium Fluoride 40%

Ammonium fluoride is a buffer used in buffered oxide etchants. It keeps the etch rate on silicon oxide constant, as well as prevents HF from penetrating photoresist.

Solution Container Type Download Datasheet
Ammonium Fluoride 40% Cleanroom® MB BOTTLE Download
Ammonium Fluoride 40% Cleanroom® MB DRUM Download

Buffered Oxide Etch

Buffered Oxide Etch is used for semiconductor patterning in silicon dioxide and cleaning applications.

Solution Container Type Download Datasheet
Buffered Oxide Etch 6:1 BOTTLE Download
Buffered Oxide Etch 6:1 DRUM Download
Buffered Oxide Etch 7:1 BOTTLE Download
Buffered Oxide Etch 10:1 BOTTLE Download
Buffered Oxide Etch 10:1 DRUM Download
Buffered Oxide Etch 20:1 DRUM Download
Buffered Oxide Etch 30:1 BOTTLE Download
Buffered Oxide Etch 50:1 BOTTLE Download
Buffered Oxide Etch 100:1 BOTTLE Download
Buffered Oxide Etch 100:1 DRUM Download

Chrome Etch

Chrome Etch removes excess metallic chrome, leaving a well-defined chrome pattern on a glass mask.

Solution Container Type Download Datasheet
Chrome Etch BOTTLE Download
Chrome Etch DRUM Download

Defreckle Etch

Defreckle Etch is a chemical used for a quick etch following the aluminum etching.

Solution Container Type Download Datasheet
Defreckle Etch BOTTLE Download

Hydrogen Peroxide

Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity of the hydrogen peroxide is critical to surface roughness and metallic residual levels on the wafer.

Solution Container Type Download Datasheet
Hydrogen Peroxide 30% Gigabit® BOTTLE Download
Hydrogen Peroxide 30% Gigabit® DRUM Download
Hydrogen Peroxide 30% Cleanroom® LP BOTTLE Download
Hydrogen Peroxide 30% Cleanroom® LP DRUM Download
Hydrogen Peroxide 30% Cleanroom® MB BOTTLE Download
Hydrogen Peroxide 30% Cleanroom® MB DRUM Download
Hydrogen Peroxide 30% Terabit® DRUM Download

ITO Etch 1

Indium Tin Oxide (ITO) has optical transparency and good electrical conductivity. ITO is used in flat panel displays for camera, television, and smart phones.

Solution Container Type Download Datasheet
ITO Etch 1 DRUM Download

Mixed Acid Etchant

Mixed Acid Etchant (MAE®) consists of volume ratios of Nitric Acid, Hydrofluoric Acid and Acetic Acid. Mixed Acid Etchants are widely used to etch silicon substrates and polysilicon films.

Solution Container Type Download Datasheet
Mixed Acid Etchant 1:1:0-Entegris PFA-245 BOTTLE Download
Mixed Acid Etchant 25:1:0-Entegris PFA-270 BOTTLE Download
Mixed Acid Etchant 3:1:0-Poly Bottle-21 BOTTLE Download
Mixed Acid Etchant 2:1:1-Poly Bottle-20 BOTTLE Download
Mixed Acid Etchant 5:1:0-Poly Bottle-21 BOTTLE Download
Mixed Acid Etchant 5:1:2-Poly Bottle-20 BOTTLE Download
Mixed Acid Etchant 1:1:0-Poly Bottle-20 BOTTLE Download
Mixed Acid Etchant 4:1:0-Poly Bottle-21 BOTTLE Download
Mixed Acid Etchant 6:1:1:-Poly Bottle-21 BOTTLE Download
Mixed Acid Etchant 57:18:25-CX Base 150-250 DRUM Download
Mixed Acid Etchant 10:1:2-Poly Bottle-21 BOTTLE Download
Mixed Acid Etchant 3:1:2 BOTTLE Download
Mixed Acid Etchant 7:1:1 BOTTLE Download
Mixed Acid Etchant 5:2:2 BOTTLE Download
Mixed Acid Etchant 3:1:0 BOTTLE Download

Pad Etch

Pad Etch is a gentle silicon dioxide etchant that minimizes corrosion on underlying aluminum.

Solution Container Type Download Datasheet
Pad Etch 1 BOTTLE Download
Pad Etch 4 BOTTLE Download

Poly Etch

Poly Etch Is a high purity acid blend used for controlled silicon etching.

Solution Container Type Download Datasheet
Poly Etch 95% BOTTLE Download

Residue Oxide Etch

Residue Oxide Etch is a fluoride-based chemistry in an organic solvent. The fluoride species attacks and breaks down the residue to a form that allows the solvent to dissolve and remove the residue from the wafer surface.

Solution Container Type Download Datasheet
Residue Oxide Etch 2 BOTTLE Download
Residue Oxide Etch 4 BOTTLE Download

Rough Etch

Rough Etch is a bulk silicon remover at a high etch rate.

Solution Container Type Download Datasheet
Rough Etch DRUM Download
Rough Etch 3 DRUM Download

Schimmel Etch

Schimmel Etch is a composition of chemicals that highlights defects in silicon. These defects can be dislocations in the silcon, stacking faults, pits or voids, and precipitates.


SEZ BT Etch

SEZ etchants remove silicon and contaminant at a high etch rate on the back of silicon wafers.

Solution Container Type Download Datasheet
SEZ BT Etch DRUM Download
SEZ BT w/Surfactant DRUM Download

Smooth Etch

Smooth Etch is a bulk silicon remover at a high etch rate.

Solution Container Type Download Datasheet
Smooth Etch DRUM Download

Ultra Etch®

Wet chemical etching is an integral part of semiconductor manufacturing process. KMG's line of buffered oxide etchants offers a variety of silicon dioxide etching rates and characteristics to meet your processing needs. The family includes standard BOEs, Ultra Etch® surfactanated BOEs, Ultra Etch® LFE (low fluoride etchants) and custom blends.

Solution Container Type Download Datasheet
Ultra Etch® NP 6:1 BOTTLE Download
Ultra Etch® NP 7:1 BOTTLE Download
Ultra Etch® NP 9:1 BOTTLE Download
Ultra Etch® NP 10:1 BOTTLE Download
Ultra Etch® NP 15:1 BOTTLE Download
Ultra Etch® NP 20:1 BOTTLE Download
Ultra Etch® NP 50:1 BOTTLE
Ultra Etch® NP 500:1 BOTTLE Download
Ultra Etch® LFE 600 NP BOTTLE Download
Ultra Etch® LFE 4K DRUM Download

Wright Etch

Wright Etch is a selective silicon etch used for differential etching to induce pattern defects.

Solution Container Type Download Datasheet
Wright Etch A BOTTLE Download
Wright Etch B BOTTLE Download