- Acetic Copper Clean
Acetic Copper Clean is a mixed acid etch (MAE) with high acetic acid content and low nitric acid and hydrofluoric acid. It allow for controlled etching in special applications.
Solution Container Type Download Datasheet Acetic Copper Clean BOTTLE
- Aluminum Etch
Aluminum Etch allows for the controlled removal of excess aluminum, leaving a well-defined pattern of aluminum wiring.
- Ammonium Fluoride 40%
Ammonium fluoride is a buffer used in buffered oxide etchants. It keeps the etch rate on silicon oxide constant, as well as prevents HF from penetrating photoresist.
Solution Container Type Download Datasheet Ammonium Fluoride 40% Cleanroom® MB BOTTLE Ammonium Fluoride 40% Cleanroom® MB DRUM
- Buffered Oxide Etch
Buffered Oxide Etch is used for semiconductor patterning in silicon dioxide and cleaning applications.
- Chrome Etch
Chrome Etch removes excess metallic chrome, leaving a well-defined chrome pattern on a glass mask.
Solution Container Type Download Datasheet Chrome Etch BOTTLE Chrome Etch DRUM
- Defreckle Etch
Defreckle Etch is a chemical used for a quick etch following the aluminum etching.
Solution Container Type Download Datasheet Defreckle Etch BOTTLE
- Hydrogen Peroxide
Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity of the hydrogen peroxide is critical to surface roughness and metallic residual levels on the wafer.
- ITO Etch 1
Indium Tin Oxide (ITO) has optical transparency and good electrical conductivity. ITO is used in flat panel displays for camera, television, and smart phones.
Solution Container Type Download Datasheet ITO Etch 1 DRUM
- Mixed Acid Etchant
Mixed Acid Etchant (MAE®) consists of volume ratios of Nitric Acid, Hydrofluoric Acid and Acetic Acid. Mixed Acid Etchants are widely used to etch silicon substrates and polysilicon films.
- Pad Etch
Pad Etch is a gentle silicon dioxide etchant that minimizes corrosion on underlying aluminum.
Solution Container Type Download Datasheet Pad Etch 1 BOTTLE Pad Etch 4 BOTTLE
- Poly Etch
Poly Etch Is a high purity acid blend used for controlled silicon etching.
Solution Container Type Download Datasheet Poly Etch 95% BOTTLE
- Residue Oxide Etch
Residue Oxide Etch is a fluoride-based chemistry in an organic solvent. The fluoride species attacks and breaks down the residue to a form that allows the solvent to dissolve and remove the residue from the wafer surface.
Solution Container Type Download Datasheet Residue Oxide Etch 2 BOTTLE Residue Oxide Etch 4 BOTTLE
- Rough Etch
Rough Etch is a bulk silicon remover at a high etch rate.
Solution Container Type Download Datasheet Rough Etch DRUM Rough Etch 3 DRUM
- Schimmel Etch
Schimmel Etch is a composition of chemicals that highlights defects in silicon. These defects can be dislocations in the silcon, stacking faults, pits or voids, and precipitates.
- SEZ BT Etch
SEZ etchants remove silicon and contaminant at a high etch rate on the back of silicon wafers.
Solution Container Type Download Datasheet SEZ BT Etch DRUM SEZ BT w/Surfactant DRUM
- Smooth Etch
Smooth Etch is a bulk silicon remover at a high etch rate.
Solution Container Type Download Datasheet Smooth Etch DRUM
- Ultra Etch®
Wet chemical etching is an integral part of semiconductor manufacturing process. KMG's line of buffered oxide etchants offers a variety of silicon dioxide etching rates and characteristics to meet your processing needs. The family includes standard BOEs, Ultra Etch® surfactanated BOEs, Ultra Etch® LFE (low fluoride etchants) and custom blends.
- Wright Etch
Wright Etch is a selective silicon etch used for differential etching to induce pattern defects.
Solution Container Type Download Datasheet Wright Etch A BOTTLE Wright Etch B BOTTLE