- Acetic Copper Clean
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Acetic Copper Clean is a mixed acid etch (MAE) with high acetic acid content and low nitric acid and hydrofluoric acid. It allow for controlled etching in special applications.
Solution Container Type Download Datasheet Acetic Copper Clean BOTTLE 
- Aluminum Etch
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Aluminum Etch allows for the controlled removal of excess aluminum, leaving a well-defined pattern of aluminum wiring.
Solution Container Type Download Datasheet Aluminum Etch 85:2:13 BOTTLE Aluminum Etch 16:1:1:2 BOTTLE Aluminum Etch 16:1:1:2 DRUM Aluminum Etch 16:13:1:2 BOTTLE Aluminum Etch 16:9:1:2 DRUM Aluminum Etch II w/ Surfactant NP BOTTLE Aluminum Etch II w/ Surfactant NP DRUM Aluminum Etch w/ Surfactant NP 16:1:1:2 BOTTLE Aluminum Etch w/ Surfactant NP 16:1:1:2 DRUM
- Ammonium Fluoride 40%
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Ammonium fluoride is a buffer used in buffered oxide etchants. It keeps the etch rate on silicon oxide constant, as well as prevents HF from penetrating photoresist.
Solution Container Type Download Datasheet Ammonium Fluoride 40% Cleanroom® MB BOTTLE Ammonium Fluoride 40% Cleanroom® MB DRUM
- Buffered Oxide Etch
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Buffered Oxide Etch is used for semiconductor patterning in silicon dioxide and cleaning applications.
Solution Container Type Download Datasheet Buffered Oxide Etch 6:1 BOTTLE Buffered Oxide Etch 6:1 DRUM Buffered Oxide Etch 7:1 BOTTLE Buffered Oxide Etch 10:1 BOTTLE Buffered Oxide Etch 10:1 DRUM Buffered Oxide Etch 20:1 DRUM Buffered Oxide Etch 30:1 BOTTLE Buffered Oxide Etch 50:1 BOTTLE Buffered Oxide Etch 100:1 BOTTLE Buffered Oxide Etch 100:1 DRUM
- Chrome Etch
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Chrome Etch removes excess metallic chrome, leaving a well-defined chrome pattern on a glass mask.
Solution Container Type Download Datasheet Chrome Etch BOTTLE Chrome Etch DRUM
- Defreckle Etch
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Defreckle Etch is a chemical used for a quick etch following the aluminum etching.
Solution Container Type Download Datasheet Defreckle Etch BOTTLE
- Hydrogen Peroxide
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Hydrogen peroxide is used in SC-1 and SC-2 solutions to remove particles from silicon wafers and to remove surface metallic contamination. The purity of the hydrogen peroxide is critical to surface roughness and metallic residual levels on the wafer.
Solution Container Type Download Datasheet Hydrogen Peroxide 30% Gigabit® BOTTLE Hydrogen Peroxide 30% Gigabit® DRUM Hydrogen Peroxide 30% Cleanroom® LP BOTTLE Hydrogen Peroxide 30% Cleanroom® LP DRUM Hydrogen Peroxide 30% Cleanroom® MB BOTTLE Hydrogen Peroxide 30% Cleanroom® MB DRUM Hydrogen Peroxide 30% Terabit® DRUM
- ITO Etch 1
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Indium Tin Oxide (ITO) has optical transparency and good electrical conductivity. ITO is used in flat panel displays for camera, television, and smart phones.
Solution Container Type Download Datasheet ITO Etch 1 DRUM
- Mixed Acid Etchant
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Mixed Acid Etchant (MAE®) consists of volume ratios of Nitric Acid, Hydrofluoric Acid and Acetic Acid. Mixed Acid Etchants are widely used to etch silicon substrates and polysilicon films.
Solution Container Type Download Datasheet Mixed Acid Etchant 1:1:0-Entegris PFA-245 BOTTLE Mixed Acid Etchant 25:1:0-Entegris PFA-270 BOTTLE Mixed Acid Etchant 3:1:0-Poly Bottle-21 BOTTLE Mixed Acid Etchant 2:1:1-Poly Bottle-20 BOTTLE Mixed Acid Etchant 5:1:0-Poly Bottle-21 BOTTLE Mixed Acid Etchant 5:1:2-Poly Bottle-20 BOTTLE Mixed Acid Etchant 1:1:0-Poly Bottle-20 BOTTLE Mixed Acid Etchant 4:1:0-Poly Bottle-21 BOTTLE Mixed Acid Etchant 6:1:1:-Poly Bottle-21 BOTTLE Mixed Acid Etchant 57:18:25-CX Base 150-250 DRUM Mixed Acid Etchant 10:1:2-Poly Bottle-21 BOTTLE Mixed Acid Etchant 3:1:2 BOTTLE Mixed Acid Etchant 7:1:1 BOTTLE Mixed Acid Etchant 5:2:2 BOTTLE Mixed Acid Etchant 3:1:0 BOTTLE
- Pad Etch
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Pad Etch is a gentle silicon dioxide etchant that minimizes corrosion on underlying aluminum.
Solution Container Type Download Datasheet Pad Etch 1 BOTTLE Pad Etch 4 BOTTLE
- Poly Etch
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Poly Etch Is a high purity acid blend used for controlled silicon etching.
Solution Container Type Download Datasheet Poly Etch 95% BOTTLE
- Residue Oxide Etch
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Residue Oxide Etch is a fluoride-based chemistry in an organic solvent. The fluoride species attacks and breaks down the residue to a form that allows the solvent to dissolve and remove the residue from the wafer surface.
Solution Container Type Download Datasheet Residue Oxide Etch 2 BOTTLE Residue Oxide Etch 4 BOTTLE
- Rough Etch
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Rough Etch is a bulk silicon remover at a high etch rate.
Solution Container Type Download Datasheet Rough Etch DRUM Rough Etch 3 DRUM
- Schimmel Etch
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Schimmel Etch is a composition of chemicals that highlights defects in silicon. These defects can be dislocations in the silcon, stacking faults, pits or voids, and precipitates.
- SEZ BT Etch
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SEZ etchants remove silicon and contaminant at a high etch rate on the back of silicon wafers.
Solution Container Type Download Datasheet SEZ BT Etch DRUM SEZ BT w/Surfactant DRUM
- Smooth Etch
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Smooth Etch is a bulk silicon remover at a high etch rate.
Solution Container Type Download Datasheet Smooth Etch DRUM
- Ultra Etch®
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Wet chemical etching is an integral part of semiconductor manufacturing process. KMG's line of buffered oxide etchants offers a variety of silicon dioxide etching rates and characteristics to meet your processing needs. The family includes standard BOEs, Ultra Etch® surfactanated BOEs, Ultra Etch® LFE (low fluoride etchants) and custom blends.
Solution Container Type Download Datasheet Ultra Etch® NP 6:1 BOTTLE Ultra Etch® NP 7:1 BOTTLE Ultra Etch® NP 9:1 BOTTLE Ultra Etch® NP 10:1 BOTTLE Ultra Etch® NP 15:1 BOTTLE Ultra Etch® NP 20:1 BOTTLE Ultra Etch® NP 50:1 BOTTLE Ultra Etch® NP 500:1 BOTTLE Ultra Etch® LFE 600 NP BOTTLE Ultra Etch® LFE 4K DRUM
- Wright Etch
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Wright Etch is a selective silicon etch used for differential etching to induce pattern defects.
Solution Container Type Download Datasheet Wright Etch A BOTTLE Wright Etch B BOTTLE
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Electronic Chemicals: Performance Products
KMG Electronic Chemical’s Performance Products Group offers a broad range of products and services required to achieve specific application criteria in semiconductor manufacturing. The increasingly finer line geometries required of semiconductor fabs worldwide make the precision manufacturing and blending of custom performance process chemicals more critical than ever.
In order to meet these critical needs, KMG Electronic Chemicals offers:
- Temperature-controlled manufacturing, storage, transportation and delivery
- Premixed products manufactured to exacting specifications
- Statistical process control of assay
KMG Electronic Chemical ensures the consistency of etchants and mixes through stringent mixing procedures, sampling protocol and control of trace metals.
The Performance Products Group will manufacture to your custom specifications or we can provide our own products recommended for such applications.
What sets KMG’s Performance Products Group apart is quality. Each product is mixed in a cleanroom environment, filtered and particle counted, and packaged in containers specially designed and manufactured for us to preserve the integrity of the chemicals you purchase.
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